Nordson DAGE (A division of Nordson Corporation – NASDAQ: NDSN); designers and manufacturers of multi-award winning x-ray systems for the electronics industry, turned to DaRo Products when it came to building their latest concept – the XM8000 (shown below) and the product was previewed last month (January 20th – 22nd 14) at the SEMI European 3D TSV Summit which took place in Grenoble in France.
The Nordson DAGE XM8000 offers fast automatic X-ray measurement of TSVs, 3D packages, MEMS and wafer bumps for voiding, fill level, overlay and other critical dimensions.
This new platform takes the market-leading capabilities from Nordson DAGE’s existing X-ray systems to provide an automated, high-throughput X-ray metrology and defect review system for both optically hidden and visible features of TSVs, 2.5D and 3D IC packages, MEMS and wafer bumps.
This was an exciting new development for DaRo Products who, can expand into other areas of x-ray technology as will now receive further approval for work on lead-lined cabinets for x-ray equipment and other equipment giving off similar levels of radioactive emission.
DaRo Products continue to expand their horizons, and the philosophy of real customer partnerships coupled with a disciplined continuous improvement programme is really opening up new and exciting markets.