Nordson DAGE (A division of Nordson Corporation – NASDAQ: NDSN); designers and manufacturers of multi-award winning x-ray systems for the electronics industry, turned to DaRo Products when it came to building their latest concept – the XM8000 (shown below) and the product was previewed last month (January 20th – 22nd 14) at the SEMI European 3D TSV Summit which took place in Grenoble in France.
The Nordson DAGE XM8000 offers fast automatic X-ray measurement of TSVs, 3D packages, MEMS and wafer bumps for voiding, fill level, overlay and other critical dimensions.
This new platform takes the market-leading capabilities from Nordson DAGE’s existing X-ray systems to provide an automated, high-throughput X-ray metrology and defect review system for both optically hidden and visible features of TSVs, 2.5D and 3D IC packages, MEMS and wafer bumps.

DAGE X-Ray Cabinet

This was an exciting new development for DaRo Products who, can expand into other areas of x-ray technology as will now receive further approval for work on lead-lined cabinets for x-ray equipment and other equipment giving off similar levels of radioactive emission.

DaRo Products continue to expand their horizons, and the philosophy of real customer partnerships coupled with a disciplined continuous improvement programme is really opening up new and exciting markets.